Method and apparatus for processing workpieces

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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Details

134 1, 219 1055R, 219 1055A, 427314, 427 58, B05D 314, B05B 1506

Patent

active

042810310

ABSTRACT:
An arrangement is provided for performing a plurality of processes on workpieces, such as silicon wafers, while they remain at a single processing station. The processing operations include scrubbing, coating, developing, and/or baking the wafer without removing it from a work support at the work station. The apparatus includes a transferring device for automatically transferring the wafer from a cassette to a work support. In addition, positioned about the centrally-located work support is a scrubbing device for scrubbing the wafer and a liquid dispensing device for dispensing liquid on the wafer. Each is movable into and out of position over the work support. In addition, the work support is surrounded by a microwave chamber for baking the wafer while it remains on the work support.

REFERENCES:
patent: 3457894 (1969-07-01), David
patent: 3479222 (1969-11-01), David et al.
patent: 3803660 (1974-04-01), Jividen et al.
patent: 3898411 (1975-08-01), Smeets
patent: 4062463 (1977-12-01), Hillman et al.
patent: 4123306 (1978-10-01), Landry

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