Patent
1990-10-02
1991-09-10
James, Andrew J.
357 74, 357 81, H01L 2342, H01L 2344, H01L 2346, H01L 2302
Patent
active
050478362
ABSTRACT:
According to the present invention, one surface of a temperature compensator is arranged to face the surface of a first electrode which is formed on one surface of a semiconductor element while one surface of a first external electrode is arranged to face the other surface of the temperature compensator. A second external electrode is arranged in a space region which is defined by a through hole of the temperature compensator and a cavity of the first external electrode, to face the surface of a second electrode. An insulator is interposed between the outer side surface of the second external electrode and the inner side surfaces of the cavity and the through hole so that the second external electrode is located in prescribed positional relation to the first external electrode and the temperature compensator. Thus, there is no possibility that the misregistration is caused between the temperature compensator, the first external electrode, the second external electrode and the insulator, whereby the temperature compensator and the second electrode can be correctly and easily aligned with the first electrode and the second external electrode, respectively.
James Andrew J.
Meier Stephen D.
Mitsubishi Denki & Kabushiki Kaisha
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