Semiconductor integrated circuit with electrode pad suited for a

Details Semiconductor integrated circuit with electrode pad suited for a Semiconductor integrated circuit with electrode pad suited for a

1978-09-15

1980-09-16

James, Andrew J.

Electrical transmission or interconnection systems

Nonlinear reactor systems

Parametrons

357 65, 357 46, 357 71, 307315, H01L 2348, H01L 2944, H01L 2952

Patent

active

042233372

ABSTRACT:
An integrated circuit device is provided with a divided electrode pad which permits checking the electrical characteristics of individual circuit elements before assembly into a package housing. After testing, the divided electrode pad is connected by thermally bonding one end of a single lead wire or the like to the divided parts.

REFERENCES:
patent: 3274667 (1966-09-01), Siebertz
patent: 3558992 (1971-01-01), Heuner et al.
patent: 3676922 (1972-07-01), Cook
patent: 3761787 (1973-09-01), Davis et al.
patent: 4010488 (1977-03-01), Gruszka et al.

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