Using microspheres as a stress buffer for integrated circuit pro

Details Using microspheres as a stress buffer for integrated circuit pro Using microspheres as a stress buffer for integrated circuit pro

1998-08-13

2000-07-11

Bowers, Charles

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438118, 438124, 438127, 257687, 257701, H01L 2144, H01L 2148, H01L 2150, H01L 2322, H01L 2324

Patent

active

060872004

ABSTRACT:
A process for packaging a die uses compressible microspheres to form a stress buffer layer between the die and an epoxy encapsulant to absorb stresses on the die caused by the different thermal expansion rates of the epoxy and die during temperature changes. By using a compressible layer of microspheres or other material, the need for a nitride passivation or other insulating layer to protect the die from thermally-induced stress is eliminated. In addition, the number and size of the microspheres and the amount of epoxy used to seal the package can be adjusted so that the epoxy is approximately co-planar with the top of the package to allow the package to be handled and used with standard equipment and processes.

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