Method of metallizing high aspect ratio apertures

Details Method of metallizing high aspect ratio apertures Method of metallizing high aspect ratio apertures

1996-04-22

1996-11-19

Pianalto, Bernard

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

20419217, 427 99, 427124, 427125, 427237, 427238, 427250, 427258, 427294, 427299, 427406, 4274431, B05D 512

Patent

active

055760520

ABSTRACT:
A method of manufacturing high aspect ratio plated through holes in a circuit carrying substrate. High aspect ratio apertures or holes (16) are formed in a substrate (10). A thin film of copper (20) is sputtered onto the substrate and in the apertures that a macroscopically discontinuous copper film (26) is formed on part of the aperture walls. The macroscopically discontinuous copper film is substantially thinner than the copper film that is deposited on the surface. A catalytic copper coating (30) is plated directly on the vacuum deposited thin film of copper by electroless copper plating in a manner sufficient to form a macroscopically continuous copper layer on the aperture walls.

REFERENCES:
patent: 4054483 (1977-10-01), Peiffer
patent: 4521280 (1985-06-01), Bahrle et al.

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