Interconnected solder pads and the method of soldering

Details Interconnected solder pads and the method of soldering Interconnected solder pads and the method of soldering

1983-10-26

1985-12-10

Ramsey, Kenneth J.

Metal fusion bonding

Solder form

156644, 1566591, B23K 3514

Patent

active

045574111

ABSTRACT:
A new soldering technique is being employed whereby solder is formed into pads, each pad connected to the next pad by a solder link. The pads are formed on center spacings equal to the spaces between assembly board terminals and heated to the melting point of the solder whereupon surface tension of the solder collapses the interconnecting pad links thereby leaving the terminals electrically isolated. The solder pad assembly is made by an etching process.

REFERENCES:
patent: 3931719 (1976-01-01), Schwab
patent: 4050621 (1977-09-01), Bouley
patent: 4216350 (1980-08-01), Reid
patent: 4328921 (1982-05-01), Liang
patent: 4336639 (1982-06-01), Berglund
patent: 4341921 (1982-07-01), Simpson
patent: 4372037 (1983-02-01), Scapple et al.

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