CMP platen plug

Details CMP platen plug CMP platen plug

1999-03-05

2000-07-11

Rachuba, M.

Abrading

Machine

Rotary tool

260508, B24B 700

Patent

active

060864648

ABSTRACT:
An improved chemical mechanical polishing apparatus for polishing a semiconductor wafer used in the fabrication of silicon-based semiconductor devices is provided so as to eliminate an air pocket bubble from being formed underneath a polishing pad without the need for cutting the same. This is achieved by a CMP platen plug which is disposed in a recess formed in a top cover plate member so as to completely fill the recess in order to displace the air pocket. The polishing pad is then secured over the platen plug and the top cover plate member. As a result, the useful life of the polishing pad has been prolonged.

REFERENCES:
patent: 2047256 (1936-07-01), Courter
patent: 3307300 (1967-03-01), Field
patent: 3562968 (1971-02-01), Johnson et al.
patent: 3742656 (1973-07-01), Amos
patent: 5910041 (1999-08-01), Duescher
patent: 5967882 (1999-10-01), Duescher
patent: 5993298 (1999-11-01), Duescher

Affiliated with

Also associated with

Rating

CMP platen plug does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with CMP platen plug, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and CMP platen plug will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-536461