Method for manufacturing a semiconductor package including a gla

Details Method for manufacturing a semiconductor package including a gla Method for manufacturing a semiconductor package including a gla

1991-11-20

1993-04-06

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437215, 437218, 437221, 437915, 29837, 29845, H01L 2152, H01L 2158, H01L 2160

Patent

active

052003639

ABSTRACT:
An electronic component with at least one silicon chip is proposed, where the silicon chip is provided with electronic switching elements on at least one main surface. The silicon chip is bonded to a glass support with its main surface provided with the electronic switching elements and forms a unit together with it, which is applied to a housing having connector pins for the electrical contact with the silicon chip. The glass support has through-bores in the same modular pattern as the connector pins of the housing, into which the connector pins extend. The through-bores in the glass support are filled with conductive paste, so that the electrical contact between the silicon chip and the connector pins is provided by the conductive paste.

REFERENCES:
patent: 3021461 (1962-02-01), Oakes et al.
patent: 3370203 (1968-02-01), Kravitz et al.
patent: 3605062 (1971-09-01), Tinkelenberg et al.
patent: 4750092 (1988-06-01), Werther
patent: 4868638 (1989-09-01), Hirata
patent: 4951510 (1990-08-01), Holm-Kennedy et al.

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