Method of attaching conductive traces to an encapsulated semicon

Details Method of attaching conductive traces to an encapsulated semicon Method of attaching conductive traces to an encapsulated semicon

1991-09-09

1993-04-06

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437211, H01L 2156, H01L 2158, H01L 2160

Patent

active

052003620

ABSTRACT:
A semiconductor device and a method for its fabrication are disclosed. In a preferred embodiment, a pattern of conductive traces is formed on a film of transfer material. A semiconductor device die is interconnected to the pattern of conductive traces and a resin body is formed around the die, one side of the conductive traces, and the interconnecting means. The film of transfer material forms, at this stage of the process, one side of the package. The film of transfer material is then peeled from the pattern of conductive traces and the resin body to expose the other side of the pattern of conductive traces. Contact to the other side of the pattern provides electrical contact to the senmiconductor device die.

REFERENCES:
patent: 4530152 (1985-07-01), Roch et al.
patent: 4635356 (1987-01-01), Ohuchi et al.

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