Method and apparatus for loading circuit boards

Metal working – Method of mechanical manufacture – Electrical device making

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Details

29741, 29809, 221301, 414126, 414404, H05K 330

Patent

active

042221668

ABSTRACT:
Method and apparatus for serially dispensing dual-in-line-type integrated circuit devices for use in manually loading circuit boards. Integrated circuit devices are placed in queues in a plurality of dispensers. The dispensers are adapted to serially release individual circuit devices to an access position within the dispensers. The dispensers are mounted on laterally moveable frames in a rack and can be withdrawn from the rack over a circuit board at an array position substantially directly over and adjacent the position on the circuit board into which the circuit devices are to be loaded. The dispensers comprise an indexing head which is adapted to release only single ones of circuit devices for rapid and convenient manual transfer from the access position of the dispensers to the load position of the board. A plurality of stations can be disposed in an assembly line with a board advancement mechanism to implement speed controlled loading of circuit boards.

REFERENCES:
patent: 2738899 (1956-03-01), Hansen et al.
patent: 3138288 (1964-06-01), Ine et al.
patent: 3265246 (1966-08-01), Messenger
patent: 3365259 (1968-01-01), Heisman et al.
patent: 3564691 (1971-02-01), Ackerman
patent: 3753606 (1973-08-01), Ozeki
patent: 3760484 (1973-09-01), Kowalski
Advertisement: Micro Electronic Systems, Inc., Pic-A-Dip IC Dispenser.
Advertisement: Pic-A-Dip III (from Micro Electronic Systems, Inc., IC Handling Tools and Systems Catalog.

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