Wire bonding system

Details Wire bonding system Wire bonding system

1991-12-19

1993-04-06

Ramsey, Kenneth J.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228 9, 228102, 228103, H01L 2160

Patent

active

051996294

ABSTRACT:
The spots to be bonded are determined by a light intensity controller as data and bonding is carried out in accordance with the data. The data obtained are stored in a memory or disk memory. In the case of storing the data in the memory, the data is transmitted to a wire bonder as occasion demands, and the wire bonder carries out bonding in accordance with the received data. In the case of storing the data in the disk memory, the disk memory is mounted on the wire bonder. The wire bonder reads out the data from the disk memory as occasion demands and carries out wire bonding.

REFERENCES:
patent: 4288023 (1981-09-01), Larrison
patent: 4347964 (1982-09-01), Takasugi et al.
patent: 5020715 (1991-06-01), Kimura et al.
IBM Disclosure Bulletin vol. 29, No. 3, Aug. 1986.

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