Circuit board heatsink assembly and technique

Details Circuit board heatsink assembly and technique Circuit board heatsink assembly and technique

1982-07-12

1984-10-02

Truhe, J. V.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361388, H05K 720

Patent

active

044751451

ABSTRACT:
A printed circuit heatsink technique and assembly is disclosed which increases the heat dissipating capabilities of a printed circuit assembly. A thermally conductive plate is etched using the same artwork or mask employed to define the patterns of terminals and conductive areas on one surface of a printed circuit board. The plate is etched in those regions corresponding to the terminal and conductive areas so that holes are produced in the terminal areas and channels are produced in the conductive areas. The plate is then bonded to the printed circuit board prior to the attachment of the leads of electronic components through the holes formed in the thermally conductive plate. The assembly absorbs heat generated by the electronic components and provides a greater surface area for dissipating that heat without the need for specially fabricated heatsink elements or complex milling procedures.

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patent: 3124640 (1964-03-01), Armstrong
patent: 3293353 (1966-12-01), Hendriks et al.
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patent: 3509429 (1970-04-01), Craig et al.
patent: 3531579 (1970-09-01), Katz
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patent: 3758350 (1973-09-01), Weglin
patent: 4029999 (1977-06-01), Neumann et al.
patent: 4204248 (1980-06-01), Proffit et al.

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