Structure for mounting a semiconductor chip to a metal core subs

Details Structure for mounting a semiconductor chip to a metal core subs Structure for mounting a semiconductor chip to a metal core subs

1980-07-10

1983-05-10

James, Andrew J.

357 81, 357 65, H01L 2348, H01L 2302, H01L 2348

Patent

active

043832709

ABSTRACT:
A porcelain coated steel substrate for receiving thick film printed circuit thereon includes thermally and electrically conductive pedestals which are in thermal and electrical contact with the steel core. The pedestal surface is coplanar with the porcelain coating so that a substantially continuous plane surface is present. This permits semiconductor chips readily to be mounted on the substrate, the pedestals serving as heat and electrical conductors to the substrate, and serves also to facilitate the deposition of thick film elements.

REFERENCES:
patent: 2984077 (1961-05-01), Gaskill
patent: 3597834 (1971-08-01), Lathrop et al.
patent: 3745487 (1973-07-01), Milard et al.
patent: 3753056 (1973-08-01), Cooke
patent: 3784884 (1974-01-01), Zoroglo
patent: 3808474 (1974-04-01), Cooke et al.
patent: 4135168 (1979-01-01), Wade

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