Polyimide-esters and filaments

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From phenol – phenol ether – or inorganic phenolate

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

528271, 528289, 528322, C08G 7316

Patent

active

043831052

ABSTRACT:
High modulus filaments are melt-spun from polyimide-esters derived from I 6-hydroxy-2-naphthoic acid, a diphenol and 4-carboxy-N-(p-carboxyphenyl)-phthalimide; II 6-hydroxy-2-naphthoic acid, an aromatic dicarboxylic acid 4-hydroxy-N-(p-hydroxyphenyl)phthalimide; or III 6-hydroxy-2-naphthoic acid, 4-hydroxybenzoic acid and 4-carboxy-N-(p-hydroxyphenyl)phthalimide. The polyimide esters are optically anisotropic in the melt. As-spun filaments from these polymers can be heat treated while free from tension to increase their tenacity.

REFERENCES:
patent: 3542731 (1970-11-01), Culbertson
patent: 4041065 (1977-08-01), Lindberg et al.
patent: 4101488 (1978-07-01), Ishizuka et al.
patent: 4161470 (1979-07-01), Calundann
patent: 4176223 (1979-11-01), Irwin
patent: 4183839 (1980-01-01), Gagliani et al.
patent: 4206261 (1980-06-01), Laganis et al.
patent: 4219461 (1980-08-01), Calundann
patent: 4245086 (1981-01-01), Uno et al.
patent: 4256624 (1981-03-01), Calundann
Chemical Abstracts, vol. 83, p. 29, (1975).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Polyimide-esters and filaments does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polyimide-esters and filaments, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polyimide-esters and filaments will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-527023

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.