Method of mounting electronic part on circuit substrate and circ

Details Method of mounting electronic part on circuit substrate and circ Method of mounting electronic part on circuit substrate and circ

Filed on

1992-07-06

Date issued

1994-07-19

Examiner

Picard, Leo P.

Patent Class

Electricity: electrical systems and devices

SubClass

Housing or mounting assemblies with diverse electrical...

SubSubClass

For electronic systems and devices

Other Related Categories

361736, 361752, 174260, 29842, 29854, 29859, 156 84, 1563806, 257785, H05K 702, H01R 4300, H01R 900

Type

Patent

Status

active

Patent number

053315138

Description

ABSTRACT:
In order to electrically connect the projecting electrodes of an LSI with a given wiring pattern on a circuit substrate, at least a portion of the electronic part is covered with a heat-shrinkable film member which in turn is fixedly mounted on the circuit substrate by adhesive at the opposite side or all the sides of the heat-shrinkable film member. When the heat-shrinkable film member is heated, the shrinkage of the heat-shrinkable film member presses the LSI against the circuit substrate under pressure. Thus, the bumps of the LSI can be electrically connected with the wiring pattern on the circuit substrate. Therefore, the LSI can be easily mounted on the circuit substrate or replaced by a new one.

REFERENCES:
patent: 4695926 (1987-09-01), McDermott
patent: 4774643 (1988-09-01), McGinnis et al.
patent: 4858075 (1989-08-01), Butterworth
Patent Abstracts of Japan, vol. 15, No. 130, Mar. 29, 1991 Appln. No. 3-14300.
Patent Abstracts of Japan, vol. 12, No. 228, Aug. 8, 1988 Appln. No. 63-65422.
Patent Abstracts of Japan, vol. 16, No. 285, Jun. 24, 1992 Appln. No. 4-72698.

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