Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1982-09-30
1984-10-02
Godici, Nicholas P.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
228208, 106 118, 106 119, 29570, 361433, B23K 3102
Patent
active
044743238
ABSTRACT:
Connection to a tantalum capacitor electrode (17) is effected using a conductive paint layer (15), incorporating pure silver and pure copper particles, which minimizes silver leeching by a tincontaining solder alloy (18) by which the lead wire (17) is connected to the conductive paint layer (15), and thus minimizes power factor degradation.
REFERENCES:
patent: 3581159 (1971-05-01), Piper
patent: 3621442 (1971-11-01), Racht et al.
patent: 3789274 (1974-01-01), Pfister et al.
patent: 4090009 (1978-05-01), Horowitz
Croney David J.
Weeks Ronald D.
Godici Nicholas P.
International Standard Electric Corporation
Musselman, Jr. P. Weston
O'Halloran John T.
Ruzek Peter R.
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