Displacement soldering device

Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid

Patent

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Details

228180R, B23K 106

Patent

active

044743220

ABSTRACT:
A displacement soldering device comprising a container for molten solder, a support structure for supporting a printed circuit board (PCB) over the surface of solder in the container, means for displacing the surface using a partial vacuum, when molten, vertically relative to the container and support structure into contact with a PCB when supported thereby to effect a soldering operation thereon.

REFERENCES:
patent: 2771049 (1956-11-01), Fish
patent: 4047655 (1977-09-01), McCafferty
patent: 4203531 (1980-05-01), Reichel et al.

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