Prepreg for printed circuit board and substrate for printed circ

Fabric (woven – knitted – or nonwoven textile or cloth – etc.) – Coated or impregnated woven – knit – or nonwoven fabric which... – Coating or impregnation increases electrical conductivity or...

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442111, 442117, 442136, 442236, 428415, 428416, 428432, 428436, 428458, 4284774, 428530, 428901, 174121R, 524494, 525 71, 525 74, 525207, 525208, 525241, B32B 700, B32B 1710

Patent

active

057338230

ABSTRACT:
There are provided a prepreg for a printed circuit board which comprises a glass cloth impregnated with a flame retardative resin composition comprising a (A) resin composed of a (a) styrenic polymer having syndiotactic configuration, a (b) polymer having compatibility with or affinity for the component (a) and further containing polar group, and a (c) thermoplastic resin other than the components (a) and (b) and/or a rubbery elastomer; a (B) halogenated polystyrene in which the amount of halogen atoms contained in halogen compounds generated under specific conditions is at most 1000 ppm by weight; a (C) flame retardant aid; an (D) organic filler or inorganic filler; and the above glass cloth, and also a substrate for printed circuit which comprises the prepreg or a laminate comprising a plurality of the prepregs laminated on each other, at least one side of the prepreg or laminate being laminated with a metallic layer. The above substrate is greatly improved in resistance to electrolytic corrosion and imparted with high reliability, and thus can cope with high density commercial devices.

REFERENCES:
patent: 5436397 (1995-07-01), Okada

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