Method of wave soldering with unique solder pad configuration

Details Method of wave soldering with unique solder pad configuration Method of wave soldering with unique solder pad configuration

1994-01-24

1994-07-19

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228260, 228 37, H05K 334

Patent

active

053300963

ABSTRACT:
A printed circuit board is provided with a solder pad configuration for wave soldering a surface mount device with its longitudinal axis in a direction perpendicular to the solder wave. A leading solder pad is not wider than the surface mount device. A trailing solder pad is wider than the surface mount device, thereby ensuring that the trailing pad is sufficiently wet by the solder wave.

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