Electrical contact containing a braze diffusion barrier

Details Electrical contact containing a braze diffusion barrier Electrical contact containing a braze diffusion barrier

1993-04-30

1994-07-19

Bradley, P. Austin

Envelopes, wrappers, and paperboard boxes

Paperboard box

A sidewall includes a horizontally or downwardly extending...

228215, 228254, 428660, 428929, 200268, H01H 102, B23K 3102

Patent

active

053300882

ABSTRACT:
A layer selected from a group comprising: molybdenum, tantalum, tungsten, osmium, rhenium, ruthenium and an alloy of two or more thereof on the under surface of an electrical contact acts as a barrier to copper diffusion from the braze material into the contact structure. A thin nickel layer on the barrier facilitates the brazing of the barrier coated contact surface to the copper electrodes.

REFERENCES:
patent: 2427727 (1947-09-01), Huntley et al.
patent: 3000092 (1961-09-01), Scuro
patent: 3159462 (1964-12-01), Kadelburg
patent: 4345130 (1982-08-01), Okutomi et al.
patent: 4840302 (1989-06-01), Gardner et al.
patent: 5076486 (1991-12-01), Slemmons et al.

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