Semiconductor device and method of manufacturing the same

Details Semiconductor device and method of manufacturing the same Semiconductor device and method of manufacturing the same

1995-10-03

1998-03-31

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

438112, 438124, 438126, H01L 2160

Patent

active

057338027

ABSTRACT:
There is provided a semiconductor device having a very thin, highly reliable semiconductor package and a method of easily manufacturing the semiconductor apparatus. The method comprises a first step of coating and melting a thermosetting resin in a mold for resin sealing, while keeping the mold at a predetermined temperature, the mold being divided into an upper mold and a lower mold, a second step of fixing within the mold a lead frame supporting a semiconductor chip, and a third step of applying a pressure on the mold and compression-molding the resin, thus forming a package.

REFERENCES:
patent: 4999319 (1991-03-01), Hamano et al.
patent: 5304512 (1994-04-01), Arai et al.
patent: 5424250 (1995-06-01), Sawada
patent: 5496775 (1996-03-01), Brooks

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