Process formation of a thin film transistor

Fishing – trapping – and vermin destroying

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437 41TFT, 437233, 437247, H01L 21786

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057337934

ABSTRACT:
A process for formation of a thin film transistor which can be usefully applied to a high picture quality active matrix liquid crystal display is disclosed. Particularly, a process for formation of an improved polysilicon thin film transistor is disclosed. In the process for formation of a polysilicon thin film transistor, the solid phase crystallization of a non-crystalline silicon is carried out under a high pressure oxygen atmosphere, and therefore, the solid phase crystallization time for a non-crystalline silicon is shortened so as to improve the productivity, and the grain size of the polysilicon is made more uniform so as improve the electrical characteristics of the TFT (thin film transistor).

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Ipri et al, "A 600-650.degree. C Polysilicon CMOS Process for Fabricating Fully Scanned Active matrix LCDs", Proceedings of the SID, vol. 29/2; pp. 167-171, 1988.
A.C. Ipri et al., SID Proc. 29(2)(1988)167, "A 600-650C .degree. polysilicon CMOS . . . ", Feb. 1988.
T. Noguchi et al., Jpn.J.Appl.Phys. 24(6)(1985)L434 "Grain Growth . . . Polysilicon Films by Oxidation" Jun. 1985.
S. Wolf & R.N. Tauber, "Silicon Processing for the VLSI Era", vol. 1, pp. 216-219, 230-235, 1986.

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