Method of making a wire bonded microfuse

Metal working – Method of mechanical manufacture – Electrical device making

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Details

228110, 228179, H01H 6902

Patent

active

049283847

ABSTRACT:
A microfuse (10) with a ceramic chip (12), thick film pads (14), fusible wire (16), attached to pads (14) without solder or flux, ceramic coating (18) and plastic body (20). External lead (24) configuration can be axial, radial or surface mount. The method of manufacturing the fuse (10) is improved by utilizing a wire bonding technique in order to improve the quality of the manufacturing process and increase the reliability in performance of the fuse and reduce manufacturing cost.

REFERENCES:
patent: 3374330 (1968-03-01), Cameron
patent: 4337570 (1982-07-01), Woznica
patent: 4437604 (1984-03-01), Razon et al.
patent: 4534811 (1985-08-01), Ainslie et al.
patent: 4580713 (1986-04-01), Sekibaya et al.
patent: 4680568 (1987-07-01), Corrao et al.
patent: 4751489 (1988-06-01), Spaunhorst
patent: 4773157 (1988-09-01), Galloway et al.

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