Metal working – Method of mechanical manufacture – Electrical device making
Patent
1992-12-31
1994-07-19
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29852, 156 89, 156902, 264 61, H05K 336
Patent
active
053296958
ABSTRACT:
Methods of fabricating multilayer circuits are presented. In accordance with the present invention, a plurality of circuit layers are stacked, one on top of the other. At least one of the circuit layers comprise a substrate composed of a polymeric material capable of undergoing bonding such as a fluoropolymeric based substrate having vias therethrough and a circuit comprised of a layer of suitable conductive material. A fusible conductive bonding material (e.g., solder) or a noble metal is applied wherever electrical connections are desired. At least one other of the circuit layers comprises a cofired multilayer ceramic circuit having vias and circuits comprised of a layer of suitable conductive material with a fusible conductive bonding material (e.g., solder) or a noble metal applied wherever electrical connections are desired. Once stacked the circuits are subjected to lamination under heat and pressure to adhere each polymeric substrate to an adjacent ceramic substrate and to diffuse the noble metal or fuse the solder layers together to form an integral multilayer circuit having solid conductive interconnects.
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PCT/US86/01176 Method of Manufacturing Printed Circuit Boards Jan. 1987.
Olenick John A.
Traskos Richard T.
Arbes Carl J.
Rogers Corporation
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