Transfer foil having reflecting layer with fine dimple pattern r

Details Transfer foil having reflecting layer with fine dimple pattern r Transfer foil having reflecting layer with fine dimple pattern r

1992-01-24

1994-04-05

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156234, 156240, 359 3, 359 15, 430 1, 430 2, B44C 1165

Patent

active

053001699

ABSTRACT:
A method wherein a hologram is transferred from a transfer foil formed with a fine dimple pattern and having a reflecting layer, and information, e.g., an image or a character, other than information originally recorded on the hologram is added to the transferred hologram. The method comprises preparing a transfer foil having a reflection relief hologram comprising a resin layer having a fine dimple pattern, e.g., a relief hologram, a relief diffraction grating, etc., formed on the surface thereof, and a reflecting layer formed on the dimpled surface of the resin layer, transferring at least a part of the hologram to the surface of an object, and heating a part of the transferred portion with a heating device, thereby destroying the reflecting layer to record another information. Also disclosed are a method which enables a fine hologram pattern to be readily transferred to a large area, a transfer foil having a reflecting layer which enables a fine dimple pattern to be transferred precisely with excellent foil breaking characteristics, and a method of producing such a fine dimple pattern transfer foil.

REFERENCES:
patent: 4012552 (1977-03-01), Watts
patent: 4657803 (1987-04-01), Pernicano
patent: 4728377 (1988-03-01), Gallagher
patent: 4892602 (1990-01-01), Oike et al.

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