Lead frame-chip package with improved configuration

Details Lead frame-chip package with improved configuration Lead frame-chip package with improved configuration

1991-05-09

1992-12-01

LaRoche, Eugene R.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257668, 257670, 257784, H01L 2160, H01L 2348

Patent

active

051683687

ABSTRACT:
An improved package for semiconductor chips, and method of forming the package are provided. The package includes a lead frame having a central chip bonding portion and first and second sets of interdigitaled fingers. The inner ends of the first set of fingers terminate at a distance from the central chip bonding portion closer than the inner ends of the fingers of the second set at fingers. A semiconductor chip, having input/output pads is bonded to the central chip bonding portion. A first set of wires directly couples respective input/output pads on the chip to the first set of fingers. A second set of wires couples respective input/output pads on the chip with the second set of fingers. Each of the wires of the second set of wires has a first segment extending from its respective input/output pad to an intermediate bonding region, and a second segment extending from the intermediate bonding region to its respective finger of the second set of fingers.

REFERENCES:
patent: 4754317 (1988-06-01), Comstock et al.
patent: 4989069 (1991-01-01), Hawkins

Affiliated with

Also associated with

Rating

Lead frame-chip package with improved configuration does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead frame-chip package with improved configuration, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead frame-chip package with improved configuration will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-506220