Method for exposing predetermined area of peripheral part of waf

Details Method for exposing predetermined area of peripheral part of waf Method for exposing predetermined area of peripheral part of waf

1990-08-22

1992-12-01

Bowers, Jr., Charles L.

Radiation imagery chemistry: process, composition, or product th

Registration or layout process other than color proofing

430 30, 355 53, 2504421, 2504911, 2504921, G03F 900

Patent

active

051680211

ABSTRACT:
A method for exposing a peripheral part of a wafer according to the present invention is to expose the peripheral part, taking account of a correcting angle determined by calculating the amount of misalignment between a center of a wafer and a rotational center for the wafer from the amount of displacement of a sensor for detecting a peripheral edge. Therefore, any wafer-centering motion and mechanism are not required, and this method is higher in precision of exposing position.

REFERENCES:
patent: 3876301 (1975-04-01), Kosugi et al.
patent: 4003061 (1977-01-01), LaCanfora
patent: 4711567 (1987-12-01), Tanimoto
patent: 4794305 (1988-12-01), Matsukawa
patent: 4891526 (1990-01-01), Reeds
patent: 4904570 (1990-02-01), Gotou

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