Devices having shallow junctions

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357 2312, 357 41, 357 42, 357 67, H01L 2910, H01L 2702, H01L 2348

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050634224

ABSTRACT:
In CMOS based integrated circuits, stricter design rules require source and drain junctions shallower than 2500 .ANG.. By using a specific device configuration, a shallow junction is obtainable while resistance to latch-up is improved and other electrical properties, e.g., low leakage current, are maintained. To achieve this result the p-channel device should have an activation energy of the junction reverse leakage current region less than 1.12 eV, with a junction dopant region shallower than 1200 .ANG. and a monotonically decreasing junction dopant profile.

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Vaidya, S. et al. "NMOS Ring Oscillators with Cobalt-Silicided P-diffused Shallow Junctions Formed During the `Poly-Plug` Contact Doping Cycle," IEEE Trans. Elect. Dev., vol. ED-33, No. 9, 9/86, pp. 1321.
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