Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1986-11-21
1988-06-14
Godici, Nicholas P.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
228124, 228248, 22826312, 29841, B23K 3102
Patent
active
047506652
ABSTRACT:
A process for manufacturing combination covers for closing and sealing an electronic package that includes a ceramic lid having a noble metal base frame thick-filmed onto the lid and fired therewith to fuse the base metal to the lid. A gold-tin solder frame is placed over the base frame and bonded thereto to complete the cover.
REFERENCES:
patent: 3340602 (1965-02-01), Hontz
patent: 4291815 (1981-09-01), Gordon et al.
patent: 4331253 (1982-05-01), Gordon et al.
patent: 4331258 (1982-05-01), Geschwind
patent: 4356047 (1982-10-01), Gordon et al.
Zirmex, div. Demetron, Inc.-Zirmex Ceramic Lids to Hermetically Seal Chip Carriers and Side Braze Packages, Passes Mil Std 883B, 750 & 202 Test Levels.
Godici Nicholas P.
Heinrich Samuel M.
Indium Corporation of America
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