Raised source/drain transistor

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357 234, 357 2311, 357 59, 357 67, 357 71, 357 41, H01L 2978

Patent

active

049981501

ABSTRACT:
A raised source/drain transistor is provided having thin sidewall spacing insulators (54) adjacent the transistor gate (48). A first sidewall spacer (64) is disposed adjacent thin sidewall spacing insulator (54) and raised source/drain region (60). A second sidewall spacer (66) is formed at the interface between field insulating region (44) and raised source/drain region (60).

REFERENCES:
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patent: 4521952 (1985-06-01), Riseman
patent: 4532697 (1985-08-01), Ko
patent: 4581815 (1986-04-01), Cheung et al.
patent: 4597824 (1986-07-01), Shinada et al.
patent: 4636834 (1987-01-01), Shepard
patent: 4638347 (1987-01-01), Iyer
patent: 4735680 (1988-04-01), Yen
patent: 4753709 (1988-06-01), Welch et al.
Poulter et al., "Use of the Polysilicon Gate Layer for Local Interconnect in a CMOS Technology Incorporating LDD Structures", IEEE, vol. 35, No. 9, Sep. 1988.
IBM Technical Disclosure Bulletin, "MOS Gate Construction Method", vol. 29, No. 2, Oct. 1986.
"Elevated Source/Drain MOSFET", S. S. Wong et al., IEDM, copyright 1984.

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