Method of forming a ball end for a solder wire

Details Method of forming a ball end for a solder wire Method of forming a ball end for a solder wire

1994-05-17

1995-07-11

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228902, H01L 2160

Patent

active

054313295

ABSTRACT:
A method is provided for forming a ball at a lower end of a material solder wire which is arranged generally vertically. The method comprises the steps of: forming an upward stream of an oxygen-free gas surrounding the solder wire; bringing a lateral flame of combustion to a ball forming position adjacent to the upward gas stream but short of the solder wire to thermally melt the lower end of the solder wire into a ball; and causing the lower ball end of the solder wire to solidify in the upward gas stream.

REFERENCES:
patent: 4020543 (1977-03-01), Pennings
patent: 4674671 (1987-06-01), Fister
patent: 4732313 (1988-03-01), Kobayashi et al.
patent: 5170928 (1992-12-01), Farassat
patent: 5295619 (1994-03-01), Takahashi et al.

Affiliated with

Also associated with

Rating

Method of forming a ball end for a solder wire does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming a ball end for a solder wire, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming a ball end for a solder wire will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-497985