Silver-filled glass

Stock material or miscellaneous articles – Composite – Of quartz or glass

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357 80, 357 67, 357 75, 361400, 361411, 428428, 428433, 428434, 428446, 428450, 428209, 428210, 428701, 428702, B32B 1706, B22F 702, C03C 310

Patent

active

044367856

ABSTRACT:
A silver metallizing paste for attachment of silicon semi-conductive devices in lead-frame packages, specifically ceramic packages, which is less expensive than a gold preform but useable in hermetic packages, and provides better electrical and thermal conductivity, and higher bond strength, than silver polyimides. From 25 to 95% of silver is blended with a low-melting glass, preferably one having 95-96% PbO, and a paste or ink is formed with a suitable vehicle at 75-85% solids. Use of the paste follows conventional practice. Selection of Ag:glass ratio depends on the type of die bonding to be used. The paste is particularly useful in MOS technology, where low contact resistance is required, and also finds applications as a solder substitute and bonding chip capacitors. It is most advantageous in attachment of larger-area integrated circuits in that stress cracking associated with the gold-silicon eutectic is avoided.

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Geller, R. F. et al., "Some Soft Glazes of Low Thermal Expansion", J. of Research of Nat'l. Bureau of Standards, 20, Jan. 1938, pp. 57-66.
Scramaglia, R., "Powder Properties Affect Fired Film", Ceramic Industry, 119 (5), Nov. 1982, pp. 44-46.
Greenwood, R. W., "Silver Bearing Conductive Pastes", IBM Tech. Disclosure Bull., Jul. 1974, (2), p. 437.

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