Metal fusion bonding – With means to remove – compact – or shape applied flux or filler – By fluid blast or suction
Patent
1989-11-20
1991-03-05
Ramsey, Kenneth J.
Metal fusion bonding
With means to remove, compact, or shape applied flux or filler
By fluid blast or suction
228 54, B23K 303
Patent
active
049971212
ABSTRACT:
A nozzle of a solder suction device maintaining wettability with solder, excellent in corrosion resistance and heat transfer property, and optimal for solder removal work of electronic components such as integrated circuits. It is composed of a nozzle base made of material excellent in heat transfer property, and a material excellent in wettability with solder, corrosion resistance and heat transfer property, and it is integrally fixed with the nozzle tip member having a solder suction hole, and the inserting part of the nozzle tip member is inserted into the throughhole in the nozzle tip member, and a plating layer is applied and formed on the outer circumferential surface of the tip side on both sides of the plating boundary in the middle between the outer circumferential tip of the nozzle tip member and the outer circumferential tip of the nozzle base body, while a coverying layer made of material inferior in wettability with solder is applied and formed on the base end side outer circumferential surface, so that the wettability of the nozzle tip member and solder is maintained if used for a long time or many times, and that the corrosion of the portion directly contacting with the solder or flux may be prevented, thereby effectively preventing lowering of heat transfer property.
REFERENCES:
patent: 2324802 (1943-07-01), Powell
patent: 4424930 (1984-01-01), Wilhelmson
Hakko Corporation
Ramsey Kenneth J.
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