Patent
1985-12-12
1987-04-28
James, Andrew J.
357 72, 357 70, H01L 2504
Patent
active
046618376
ABSTRACT:
A resin-sealed type semiconductor device includes a semiconductor chip and a radiation shield film disposed in close contact with the surface of the chip. Internal leads are bonded to the electrodes on the chip and external leads are bonded to the internal leads. A sealing resin is molded around the chip, the radiation shield film, and the internal leads. A method for manufacturing the semiconductor device mentioned above includes the steps of mounting a semiconductor chip onto a film carrier, with the surface of the chip are in close contact with the radiation shield film of the film carrier. The electrodes on the chip are bonded to the internal leads supported by the film carrier separating the internal leads and the radiation shield film from the frame of the film carrier, thereby forming an intermediate assembly comprising the chip, the radiation shield film, and the internal leads. The intermediate assembly is mounted onto a lead frame, with the internal leads being bonded to the external leads of the lead frame and molding a sealing resin around the chip, the radiation shield film, and the internal fields, and separating the external leads from the frame portion of the lead frame.
REFERENCES:
patent: 4300153 (1981-11-01), Hayakawa et al.
Nestork et al., "Captive Decal," IBM Technical Disclosure Bulletin, vol. 22, No. 8A, Jan. 1980, pp. 3136-3137.
Fujitsu Limited
James Andrew J.
Mintel William
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