Method for increasing the height of solder bumps

Details Method for increasing the height of solder bumps Method for increasing the height of solder bumps

1986-03-07

1987-04-28

Smith, John D.

Coating processes

Electrical product produced

Condenser or capacitor

204 15, 427 90, 427 91, 427 96, 427 99, 427433, H01L 2944, H01L 2188

Patent

active

046613757

ABSTRACT:
The height of solder bumps (10) on a bonding pad (24) of a semiconductor chip (12) is increased by successively immersing the chip in molten solder alloys having progressively lower melting points.

REFERENCES:
patent: 3401055 (1968-09-01), Langdon
patent: 3454374 (1969-07-01), Domin
patent: 3479736 (1969-12-01), Toki
patent: 3585713 (1971-06-01), Kaneda
patent: 3809625 (1974-05-01), Brown
patent: 4273859 (1981-06-01), Mones et al.
patent: 4293637 (1981-10-01), Hatada
patent: 4412642 (1983-11-01), Fisher, Jr.
patent: 4427715 (1984-01-01), Harris
patent: 4451972 (1984-06-01), Batinovich
patent: 4505029 (1985-03-01), Owyang
patent: 4545610 (1985-10-01), Lakritz
Article entitled "Flip Chip Solder Terminals" by P. A. Totta in the 21st ECC (1971).
Article entitled "Flip Chip Bonding" by K. C. Chhabra et al., JIETE, May 1975.

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