Monolithic substrate for an electronic power component and proce

Details Monolithic substrate for an electronic power component and proce Monolithic substrate for an electronic power component and proce

1987-11-09

1989-03-21

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156155, 156290, B32B 1800, B32B 3106

Patent

active

048140309

ABSTRACT:
The invention concerns a monolithic substrate for an electronic power component which is formed by a sintered stack of layers of dielectric material having an internal system of ducts for the circulation of a cooling fluid. The system is a closed system which opens at the surface of the substrate by way of two orifices which respectively provide for the intake of the pressurized fluid into the internal system of ducts and the removal thereof from said system.

REFERENCES:
patent: 3852877 (1974-12-01), Ahn et al.
patent: 4026746 (1977-05-01), Straw
patent: 4488920 (1984-12-01), Denis
patent: 4617707 (1986-10-01), Mohaupt et al.

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