Method for production of wafer

Details Method for production of wafer Method for production of wafer

1994-03-21

1995-09-05

Fourson, George

Fishing, trapping, and vermin destroying

437946, 437977, 148DIG138, H01L 21304

Patent

active

054478901

ABSTRACT:
A wafer which allows manufacture of a device to proceed at an exalted yield by preventing the resolution of exposure at the step of photolithography during the manufacture of the device from being impaired is obtained by a method which comprises a slicing step for slicing a single crystal ingot thereby obtaining wafers of the shape of a thin disc, a chamfering step for chamfering the wafer obtained by the slicing step, a lapping step for imparting a flat surface to the chamfered wafer, an etching step for removing mechanical strain remaining in the lapped wafer, an obverse surface-polishing step for polishing one side of the etched wafer, and a cleaning step for cleaning the polished wafer, which method is characterized by interposing between the etching step and the obverse surface-polishing step a reverse surface-preparing step for preparing the shape of the reverse side of the wafer.

REFERENCES:
patent: 4276114 (1981-06-01), Takano et al.
patent: 4588473 (1986-05-01), Hisatomi et al.
patent: 5071776 (1991-12-01), Matsushita et al.
patent: 5097630 (1992-03-01), Maeda et al.

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