Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Patent
1997-04-10
1999-08-24
Utech, Benjamin
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
438738, 438718, H01L 21302
Patent
active
059424478
ABSTRACT:
A wafer on which a GaAs layer is disposed on an Al.sub.x Ga.sub.1-x As (0<x.ltoreq.1) layer. An etching mask is formed on the GaAs layer. An etching gas containing chlorine, oxygen, and nitrogen is fed into a reaction chamber to generate a plasma having a plasma density of 10.sup.10 cm.sup.-3 or more, and the GaAs layer is etched using the Al.sub.x Ga.sub.1-x As layer of the wafer as an etching stop layer. This selective etching method is applied to formation of a gate recess structure in a compound semiconductor device.
REFERENCES:
patent: 5512331 (1996-04-01), Miyafuni
"Selective and Nonselective vie of GaAs and AlGaAs In SiCl4 Plasma"; Murad et, al.; Microelectron Eng. (1994'); 23(1-4); abstract.
Miyakuni et al., "Low Ion Energy Electron Cyclotron Resonance Etching Of InP Using Cl.sub.2 /N.sub.2 Mixture", Journal of Applied Physics, vol. 78, No. 9, 1995, pp. 5734-5738.
Hu et al., "Recent Developments In Reactive Plasma Etching Of III-V Compound Semiconductors", SPIE, vol. 797, 1987, pp. 98-109.
Miyakuni et al., "Low Damage Etching Of InGaAs/AlGaAs By The Electron Cyclotron Resonance Plasma With Cl.sub.2 /He Mixture For Heterojunction Bipolar Transistors", Journal of Vacuum Science Technology B, vol. 12, No. 2, 1994, pp. 530-535.
Goudreau George
Mitsubishi Denki & Kabushiki Kaisha
Utech Benjamin
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