Semiconductor device

Details Semiconductor device Semiconductor device

1988-12-16

1990-08-14

Hille, Rolf

357 68, H01L 2348, H01L 2350

Patent

active

049491601

ABSTRACT:
A semiconductor device is provided with a plurality of inner leads substantially radially arranged around a pellet mounting area of a lead frame, an insulating sheet arranged on the pellet mounting area so as to adhesively fix inner lead tip portions, and a semiconductor pellet mounted on the insulating sheet, wherein each tip portion of at least every other inner lead is provided with a broader portion broader than the width of each of the other inner lead tip portions, the broader portion is positioned closer to the central portion of the lead frame than the other inner lead tip portions, and an opening or a thin portion is provided within the broader portion.

REFERENCES:
patent: 4684975 (1987-08-01), Takiar et al.
patent: 4721993 (1988-01-01), Walter
Jul., 1984, Japanese Patent Abstract (Nippon), 59-129451, Lead Frame.
1985, Japanese Patent Abstract (Toshiba), 62-1239, Semiconductor Device.
1987, Technical Report of the Institute of Electronics, Information and Communication Engineers.
Toshiba Review Article, "ASIC Packaging Technology".
"Nikkei Microdevices", Nov. 1987, p. 32.
Nikkei Microdevices Publication of Dec. 1987, pp. 76-78.
Nikkei Electronics No. 434, Nov. 16, 1987.
Japanese Industrial Paper, Dec. 10, 1987.

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