Mold method for forming vacuum field emitters and method for for

Details Mold method for forming vacuum field emitters and method for for Mold method for forming vacuum field emitters and method for for

1997-06-25

2000-10-17

Ramsey, Kenneth J.

Electric lamp or space discharge component or device manufacturi

Process

Generating gas or vapor within an envelope, or coating by...

445 6, 445 24, 445 50, 445 51, 438 20, H01J 938

Patent

active

061322784

ABSTRACT:
Diamond microtip field emitters are used in diode and triode vacuum microelectronic devices, sensors and displays. Diamond diode and triode devices having integral anode and grid structures can be fabricated. Ultra-sharp tips are formed on the emitters in a fabrication process in which diamond is deposited into mold cavities in a two-step deposition sequence. During deposition of the diamond, the carbon graphite content is carefully controlled to enhance emission performance. The tips or the emitters are treated by post-fabrication processes to further enhance performance.

REFERENCES:
patent: 4307507 (1981-12-01), Gray et al.
patent: 4851254 (1989-07-01), Yamamoto et al.
patent: 4964946 (1990-10-01), Gray et al.
patent: 5038070 (1991-08-01), Bardai et al.
patent: 5126287 (1992-06-01), Jones
patent: 5129850 (1992-07-01), Kane et al.
patent: 5138237 (1992-08-01), Kane et al.
patent: 5180951 (1993-01-01), Dworsky et al.
patent: 5202571 (1993-04-01), Hirabayashi et al.
patent: 5221221 (1993-06-01), Okaniwa
patent: 5249340 (1993-10-01), Kane et al.
patent: 5270258 (1993-12-01), Yoshida
patent: 5278475 (1994-01-01), Jaskie et al.
patent: 5283501 (1994-02-01), Zhu et al.
patent: 5289086 (1994-02-01), Kane
patent: 5345141 (1994-09-01), Moyer
patent: 5354714 (1994-10-01), Boysel
patent: 5438343 (1995-08-01), Khan et al.
patent: 5439753 (1995-08-01), Rogers
patent: 5499938 (1996-03-01), Nakamoto et al.
patent: 5580827 (1996-12-01), Akamine

Affiliated with

Also associated with

Rating

Mold method for forming vacuum field emitters and method for for does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mold method for forming vacuum field emitters and method for for, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mold method for forming vacuum field emitters and method for for will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-462980