Shaping polishing pad to control material removal rate selective

Details Shaping polishing pad to control material removal rate selective Shaping polishing pad to control material removal rate selective

1997-08-25

1999-08-24

Rose, Robert A.

Abrading

Abrading process

With tool treating or forming

451444, 451461, B24B 5300

Patent

active

059417617

ABSTRACT:
An end effector to facilitate conditioning of a surface of a polishing pad used in chemical-mechanical polishing of an substrate surface is described. The end effector includes a rigid body including a contact surface capable of being attached to a conditioning disk and having a predetermined non-planar region that is adapted to at least one of (i) effectively maintain a non-planar area on the surface of the polishing pad and (ii) shape the polishing pad, when the end effector is employed to condition the polishing pad.

REFERENCES:
patent: 5081051 (1992-01-01), Mattingly et al.
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5456630 (1995-10-01), Kaiser et al.
patent: 5536202 (1996-07-01), Appel et al.
patent: 5547417 (1996-08-01), Breivogel et al.
patent: 5605499 (1997-02-01), Sugiyama et al.

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