Patent
1989-05-11
1990-11-20
Mintel, William
357 4, 357 16, 357 71, 357 68, 357 75, H01L 2702
Patent
active
049722484
ABSTRACT:
A three-dimensional multiple-circuit layer semiconductor device has multiple circuit layers vertically stacked on a single crystal wafer. Thick single-crystal InSb film serves as conductors and contacts, thin single-crystal InSb film serves as semiconductor channels, and CdTe serves as insulator layers. The good lattice match between the two materials permits epitaxial growth of fifty or more layers.
REFERENCES:
patent: 3613226 (1971-10-01), Haisty et al.
patent: 3706130 (1972-12-01), Sellbach et al.
patent: 3761785 (1973-09-01), Pruniaux
patent: 4296428 (1981-10-01), Haraszti
patent: 4309811 (1982-01-01), Calhoun
patent: 4335161 (1982-06-01), Luo
patent: 4381201 (1983-04-01), Sakurai
patent: 4448632 (1984-05-01), Akasaka
patent: 4467518 (1984-08-01), Bansal et al.
patent: 4479297 (1984-10-01), Mizutani et al.
patent: 4489478 (1984-12-01), Sakurai
patent: 4498226 (1985-02-01), Inoue et al.
patent: 4502202 (1985-03-01), Malhi
patent: 4596604 (1986-06-01), Akiyama et al.
Ghosh Prasanta K.
Kornreich Phillip G.
Mintel William
Syracuse University
LandOfFree
Multi-layer circuit structure with thin semiconductor channels does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multi-layer circuit structure with thin semiconductor channels, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-layer circuit structure with thin semiconductor channels will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-457347