Fabrication process for circuit substrate having interconnection

Metal working – Method of mechanical manufacture – Electrical device making

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29825, 29830, 174280, 174262, H05K 334

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active

059409649

ABSTRACT:
A method for manufacturing an apparatus includes the steps of forming a plurality of circuit regions on a single master print circuit board, soldering one or more interconnection leads upon corresponding pad electrodes of the foregoing circuit regions, in a state that the plurality of circuit regions are connected with each other mechanically to form the master print circuit board, and dividing the master print circuit board into individual printed circuit boards each corresponding to one of the circuit regions on the master print circuit board.

REFERENCES:
patent: 3780431 (1973-12-01), Feeney
patent: 4316320 (1982-02-01), Nogawa et al.
patent: 4343083 (1982-08-01), Takamura et al.
patent: 4343084 (1982-08-01), Wilmarth
patent: 4426773 (1984-01-01), Hargis
patent: 4641112 (1987-02-01), Kohayakawa
patent: 4980219 (1990-12-01), Hiraide et al.
patent: 5031073 (1991-07-01), Chang
patent: 5341274 (1994-08-01), Nakatami et al.
patent: 5424633 (1995-06-01), Soiferman
patent: 5449863 (1995-09-01), Nakatani et al.
patent: 5512710 (1996-04-01), Schroeder
patent: 5517110 (1996-05-01), Soiferman

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