Method of manufacturing a semiconductor device

Fishing – trapping – and vermin destroying

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437 60, 437 63, 437 64, 437203, 437918, 437919, H01L 2176

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049719262

ABSTRACT:
A semiconductor device comprising a semiconductor substrate having a principal surface constituted by crystal plane (100) formed with a groove, which is utilized for an element isolation region, a capacitor element, etc., wherein at least one of the side wall surfaces of the groove is constituted by a (100) crystal plane. There is also proposed a method of forming a groove having at least one crystal plane side surface in a crystal plane surface of a semiconductor substrate.

REFERENCES:
patent: 3785886 (1974-01-01), Castrucci et al.
patent: 3965453 (1976-06-01), Seidel et al.
patent: 3998674 (1976-12-01), Cameron et al.
patent: 4131496 (1978-12-01), Weitzel et al.
patent: 4278987 (1981-07-01), Imaizumi et al.
patent: 4327476 (1982-05-01), Iwai et al.
patent: 4362599 (1982-12-01), Imaizumi et al.
patent: 4509249 (1985-04-01), Goto et al.
patent: 4577208 (1986-03-01), Schutten et al.
Ueda et al., "A New Vertical Power MOSFET Structure With Extremely Reduced On-Resistance", IEEE Trans. on Electron Devices, vol. ED-32, No. 1, Jan. 1985, pp. 2-6.
Cullity, Elements of X-Ray Diffraction, 2nd edition, Addison-Wesley Publishing Co., Inc., 1978.
Kendall, "On Etching Very Narrow Grooves in Silicon", Appl. Phys. Letts., vol. 26, No. 4, Feb. 15, 1975, pp. 195-198.
Kittel, C., Introduction to Solid State Physics, 4th edition, John Wiley and Sons, Inc., 1971, pp. 22-23.
Grove, A. S., Physics and Technology of Semiconductor Devices, John Wiley and Sons, Inc., 1967, p. 342.
Sunami et al., "A Corrugated Capacitor Cell (CCC)," IEEE Transactions on Electron Devices, vol. ED-31, No. 6, Jun. 1984.
Huo et al., "A Novel Etch Mask Process for the Etching of (011) Oriented Facet V-Grooves in InP (100) Wafers", J. Electrochem. Soc., vol. 134, No. 11, Nov. 1987, pp. 2850-2856.
Kendall, "Vertical Etching of Silicon at Very High Aspect Ratios", Ann. Rev. Mater. Sci., 1979.9, pp. 373-403.

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