Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1976-02-02
1981-05-26
Smith, John D.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
29837, 29840, 148 23, 228 18, 228180R, 427 97, 427310, 427313, H05K 334
Patent
active
042698707
ABSTRACT:
Electrical and electronic components loosely mounted in a circuit board with their leads extending through holes in the board are temporarily stabilized in position in the board by treating the board and component leads at least in part with a selected material in liquid state, and hardening the material to form a solid, solder-compatible, non-metallic cement having a melting point below that of solder, coupling the board and leads to one another. The component leads may then be trimmed to finish length, and the components soldered in place. Alternatively the board may be placed in storage for future soldering. The cement is melted and displaced simultaneously with soldering. Preferred as cement are naturally occurring and synthetic waxes having a melting point in the range of about 120.degree.195.degree. F. In a preferred embodiment of the invention compatible flux active agents and/or wetting agents may be intermixed with the liquid material whereby the board and component leads may be fluxed simultaneously with treating to temporarily stabilize the components in the board.
REFERENCES:
patent: 2470957 (1949-05-01), Strader
patent: 2983853 (1961-05-01), Williams
patent: 3065099 (1962-11-01), Newman
patent: 3117101 (1964-01-01), Moyer
patent: 3158927 (1964-12-01), Saunders
patent: 3350250 (1967-10-01), Sanz
patent: 3388465 (1968-06-01), Johnston
patent: 3538389 (1970-11-01), Levesque
patent: 3560420 (1971-02-01), Tamura
patent: 3704515 (1972-12-01), Nelson
patent: 3780431 (1973-12-01), Feeney
patent: 3966110 (1976-06-01), Boynton
Cooper Industries Inc.
Smith John D.
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