Heat transfer mounting arrangement for a solid state device conn

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

361427, 357 81, 174 16HS, H05K 720

Patent

active

042042488

ABSTRACT:
A solid state device, such as a power transistor, is fastened to a mounting arrangement that provides good heat conduction to a chassis or heat sink, that holds the solid state device so that its leads can be connected to a printed circuit board without strain, and that occupies a relatively small area of the printed circuit board.

REFERENCES:
patent: 2947957 (1960-08-01), Spindler
patent: 3487267 (1969-12-01), Winston
patent: 3641474 (1972-02-01), Owens
patent: 3665256 (1972-05-01), Goun
patent: 4054901 (1977-10-01), Edwards

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Heat transfer mounting arrangement for a solid state device conn does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat transfer mounting arrangement for a solid state device conn, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat transfer mounting arrangement for a solid state device conn will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-452439

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.