Multi-nozzle surface mount rework system

Heating – Processes of heating or heater operation – Controlling flame position or work atmosphere

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Details

350169, 432225, 432226, 228 19, 228 20, F27D 700, B23K 100

Patent

active

049715542

ABSTRACT:
Apparatus for rapidly and precisely removing and replacing surface mount devices without disturbance to nearby devices on a printed circuitboard, the invention utilizes a multiple nozzle arrangement wherein nozzles arranged for reciprocating motion one each along each edge of a surface mount device direct low velocity hot gas against bond joint locations along the respective edges of the surface mount device, thereby to melt the bonding agent mounting the device to the circuitboard. The multiple nozzle arrangement of the present system thus allows removal and/or replacement of devices of widely varying dimensions without the need for changes in nozzle size such as is inherent in prior art hot gas rework stations.

REFERENCES:
patent: 1956519 (1934-04-01), Thomson
patent: 2745479 (1956-05-01), Young
patent: 3536306 (1970-10-01), Selivanov et al.
patent: 3732066 (1973-05-01), Kipple et al.
patent: 4451233 (1984-05-01), Lachenmeier et al.
patent: 4488871 (1984-12-01), Cremer
patent: 4515562 (1985-05-01), Williams
patent: 4626205 (1986-12-01), Barkley et al.
patent: 4817851 (1989-04-01), Kolesar et al.
patent: 4832250 (1989-05-01), Spigarelli et al.

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