1989-04-20
1991-03-12
James, Andrew J.
357 68, H01L 2348, H01L 2352
Patent
active
049997009
ABSTRACT:
A variable pitch tab leadframe assembly comprising a plurality of patterned conductive elements for transmitting input and output signals to bonding locations on an electronic device. The leadframe assembly comprises conductive elements with a variable pitch to accommodate a plurality of standard pitch bond site printed circuit board footprints.
REFERENCES:
patent: 4575747 (1986-03-01), Fritz
patent: 4655551 (1987-04-01), Washizuka et al.
patent: 4733292 (1988-03-01), Jarvis
patent: 4760335 (1988-07-01), Lindberg
Dunaway Thomas J.
Poplett James M.
Spielberger Richard K.
Bruns Gregory A.
Honeywell Inc.
James Andrew J.
Nguyen Viet Q.
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