Method of fabricating full width scanning or imaging arrays from

Details Method of fabricating full width scanning or imaging arrays from Method of fabricating full width scanning or imaging arrays from

1989-08-31

1991-03-12

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29464, 29834, 136244, 156241, 156265, 156281, 2505781, 437209, B32B 3100

Patent

active

049990772

ABSTRACT:
A method for fabricating a coplanar full width scanning array from a plurality of relatively short scanning subunits for reading and writing images. The subunits are fixedly mounted in an end-to-end relationship on a flat structural member with the subunit surfaces containing the scanning elements all being coplanar even though at least some of the subunits have varying thickness. This is accomplished by forming from a photopatternable thick film layer one or more keys on the subunit surface having the scanning elements and associated circuitry and positioning the keys into keyways produced from a photopatternable thick film layer on a flat surface of an alignment fixture. A conformal adhesive bonds a structural member to the assembled subunits to form the full width scanning array.

REFERENCES:
patent: 3565719 (1971-02-01), Webb
patent: 4645688 (1987-02-01), Makino et al.
patent: 4690391 (1987-09-01), Stoffel et al.
patent: 4712018 (1987-12-01), Stoffel et al.
patent: 4735671 (1988-04-01), Stoffel et al.
IBM Technical Disclosure Bulletin; "Chip Protective Coating"; Martin et al.; vol. 23; No. 5; Oct. 1980.

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