Electricity: measuring and testing – Particle precession resonance – Spectrometer components
Patent
1992-03-05
1994-03-22
Arana, Louis
Electricity: measuring and testing
Particle precession resonance
Spectrometer components
324318, 1286535, G01V 300
Patent
active
052968138
ABSTRACT:
A magnetic resonance imaging apparatus defines an examination region (14) within which main magnets (10) create a uniform magnetic field. Magnetic resonance is excited in dipoles of a subject within the examination region causing the generation of magnetic resonance signals which are received by a localized coil (C). Because the localized coil is disposed within the examination region, the localized coil, particularly a magnetic resonance processing circuit (54) mounted on the coil is free of ferrous materials, such as iron and nickel, to prevent distortion of the uniform magnetic field. The circuit includes an array of component dice which are free of ferrous or other packaging. The dice are adhesively bonded to a substrate (62) and connected by whiskers (82) with electrically conductive lead lines (60) on the substrate. In one embodiment, the component dice include a transistor (Q1) and other circuit components for amplifying the received resonance signal. In another embodiment, a collection of component dice are connected by the lead lines with contact points (70). By selectively interconnecting the contact points, the same package can be used for a variety of applications and purposes. In this manner, a "universal" package is provided which can be manufactured in bulk and readily adapted to a variety of applications in or close to the uniform magnetic field.
REFERENCES:
patent: 4721913 (1988-01-01), Hyde et al.
patent: 4816765 (1989-03-01), Boskamp
patent: 4918388 (1990-04-01), Mehdizadeh et al.
patent: 4920318 (1990-04-01), Misic et al.
patent: 5076275 (1991-12-01), Bechor et al.
"Electronic Packaging, Microelectronics, and Interconnection Dictionary", Harper, et al., McGraw-Hill, Inc. Copyright 1993, pp. 30-31, 37, 54, 57-58, 61, 97-98, 103, 138-139, 190-191, and 213 (month unknown).
"High Temperature Packaging: Flip Chip on Flexible Laminate", Surface Mount Technology, Jan. 1992, vol. 6, No. 1.
Holmes Timothy B.
Scsavnicki Paul M.
Arana Louis
Picker International Inc.
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